CHAD
Industries has developed tools to handle all wafer types,
with a specific focus on addressing the non-standard wafers
that our leading-edge customers are encountering.
Thin Wafers |
Warped Wafers |
Glass Wafers |
Grooved Wafers |
Square Wafers |
Reticles |
Heavy Wafers |
Film Frames |
Perforated Wafers |
Design enhancements in gripper, aligner, cassette/carrier technology
and specialized software algorithms continue to be developed as new
challenges are faced in the rapidly evolving semiconductor market.
CHAD Industries is committed to finding creative and innovative
wafer handling solutions to support our customer's next generation
devices and wafer level process challenges, allowing them to apply
their focus on their process tool.
