Thin
Wafer Capabilities from CHAD Industries and DEK Printing
Machines
June
'09, ANAHEIM, CA - CHAD Industries has announced
that it will be demonstrating CHAD’s thin wafer handling
capabilities at this year’s SEMICON West show. Exhibiting
with CHAD Industries in a joint booth will be one of CHAD’s
key OEM customers, DEK Printing Machines. On exhibit will
be CHAD’s WaferMate200 wafer handler integrated with
DEK’s Galaxy screen printer to hand off thin wafers.
Each system will be tooled to handle 200mm wafers that are
125u” thick. Additional wafer handling capabilities
can be deployed for wafers as thin as 75u”.
CHAD
Industries will also be displaying the WaferMate300-1 workcell
equipped
for 300mm wafers, the SMIF-EZ loadport for 200mm wafers
presented in SMIF’s, and CHAD’s new open architecture
PC based control system.
“We are excited to partner with DEK Printing Machines,
one of our oldest OEM customers, and to help showcase DEK’s
new thin wafer capabilities. Our engineering teams worked together
to conceive and design a solid, reliable solution for thin wafer
handling,” said Scott Klimczak, President of CHAD Industries. “This
is just another example of how in these challenging times, we
find that our OEM customers are increasingly dependant upon CHAD
Industries to provide engineering support and solutions to their
wafer handling requirements. Recent downsizing has put more emphasis
on outsourcing, and CHAD is well positioned to provide comprehensive
engineering support to solve these new customer challenges.”
CHAD
and DEK will be located at booth #811 in the South Hall of
San
Francisco’s Moscone Center during SEMICON West,
taking place from July 14th to July 16th. Visitors are invited
to visit the booth to find out more about DEK’s thin wafer
printing process, and to learn how CHAD can apply its extensive
experience and knowledge to solve their wafer handling challenges.
About CHAD Industries
CHAD Industries is a pioneer in the area of wafer and substrate
handling for WLP (Wafer Level Packaging) applications. Working
closely with its customers, CHAD has developed solutions for
handling a variety of substrates, from 50mm to 300mm diameter
wafers; warped, thin and glass wafers as well as wafers mounted
on film frame. CHAD provides cost-effective solutions by utilizing
standard robotic platforms and designing in special end-effectors,
wafer aligners, cassette tilters, and other custom elements to
meet the exact requirements of the specific application. For
more information, visit CHAD at www.chadindustries.net.
About DEK Printing Machines
DEK Printing Machines is a global provider of advanced materials
deposition technologies and support solutions including printing
equipment platforms, stencils, precision screens and mass imaging
processes used across a wide range of applications in electronics
pre-placement subassembly, semiconductor wafer manufacture, and
alternative energy component production. For more information,
visit DEK at www.dek.com.
For more information, contact:
CHAD Industries
Richard Munro, Semiconductor Sales Manager
714-938-0080 ext. 224
richard.munro@chadindustries.net
